Moreno, Anthony and Rodriguez, Rennier and Gomez, Frederick Ray (2021) Bond Pad Probe Marks Effect on Intermetallic Coverage. Journal of Engineering Research and Reports, 20 (1). pp. 101-106. ISSN 2582-2926
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Abstract
The paper presents a study on the effect of semiconductor die’s bond pad probe marks on the interface between the wire and the bond pad. The probe marks are quantified in terms of percentage area in the bond pad, while the interface strength between the wire of Gold material to the Aluminum bond pad is measured through the intermetallic coverage (IMC). Actual evaluation showed that the size of the probe marks has significant impact on the bond pad area, especially on IMC. Validations were made comparing the IMC and shear strength performance of the wire ball bonded on the worst-case probe marks and on the standard probe marks. The learnings on this study could be used on future works with similar requirement.
Item Type: | Article |
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Subjects: | STM One > Engineering |
Depositing User: | Unnamed user with email support@stmone.org |
Date Deposited: | 23 Feb 2023 11:06 |
Last Modified: | 17 Jun 2024 06:46 |
URI: | http://publications.openuniversitystm.com/id/eprint/151 |